? semiconductor components industries, llc, 2016 november, 2016 ? rev. 1 1 publication order number: NSPM5131/d NSPM5131 13.5 v unidirectional esd and surge protection device features ? unidirectional high voltage esd protection ? provides esd protection to iec61000?4?2 level 4: 30 kv contact discharge ? iec 61000?4?5 (lighting) ? high voltage zener diode protects supply rail up to 160 a (8/20 s) ? these devices are pb?free and are rohs compliant application diagram vcc (1) dap** **die attach pad on back of package (connect to ground) gnd (5) gnd (6) marking diagram device package shipping ? ordering information block diagram www. onsemi.com udfn6 (pb?free) 3000/tape & reel NSPM5131mutbg udfn6 case 517cs ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specification brochure, brd8011/d. a3 = specific device code m = date code = pb?free package a3 m 1 cathode anode
NSPM5131 www. onsemi.com 2 table 1. pin descriptions 4?channel, 6?lead, udfn?8 package pin name type description 1 v cc hv v dd hv esd channel 2 n/c no connect 3 n/c no connect 4 n/c no connect 5 gnd ground 6 gnd ground 7 gnd ground 8 gnd ground package / pinout diagrams pin 1 marking 6?lead udfn top view (pins down view) bottom view (pins up view) 12 4 65 xx m 6 5 1 2 3 4 3 7 8 electrical characteristics symbol parameter i pp maximum reverse peak pulse current v c clamping voltage @ i pp v rwm working peak reverse voltage i r maximum reverse leakage current @ v rwm v br breakdown voltage @ i t i t test current v br maximum temperature coefficient of v br i f forward current v f forward voltage @ i f uni?directional tvs i pp i f v i i r i t v rwm v c v br v f specifications table 2. maximum ratings parameter rating units operating temperature range ?55 to +125 c storage temperature range ?65 to +150 c peak current (t p = 8/20 s) 160 a stresses at or above those listed in maximum ratings table may cause permanent damage to the device. this is a stress only rati ng and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not impl ied. also, due to variations in test equipment, stresses shown above are averages. electrical characteristics device name device marking v rwm (v ) (note 1) i r @ v rwm a) breakdown voltage v c @ i pp (8 x 20 s) (note 3) v br v (note 2) @ i t (ma) v c (v) i pp (a) max max min nom max max NSPM5131 a3 13.5 1 13.6 15.5 17.5 1 21.5 100 product parametric performance is indicated in the electrical characteristics for the listed test conditions, unless otherwise noted. product performance may not be indicated by the electrical characteristics if operated under different conditions. 1. a transient suppressor is normally selected according to the working peak reverse voltage (v rwm ), which should be equal to or greater than the dc or continuous peak operating voltage level. 2. v br measured at pulse test current i t at an ambient temperature of 25 c. 3. surge current waveform per figure 2.
NSPM5131 www. onsemi.com 3 typical characteristics figure 1. clamping voltage vs. peak pulse current (t p = 8/20 s) ipk (a) 60 40 20 0 0 5 10 15 20 25 30 vpk @ ipk (v) 140 120 100 80 180 160 figure 2. iec61000?4?5 8/20 s pulse waveform time ( s) 50 0 ipp - peak pulse current - %ipp 100 t r = rise time to peak value [8 s] t f = decay time to half value [20 s] t r t f peak value half value 0
NSPM5131 www. onsemi.com 4 package dimensions notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. dimension b applies to plated terminals and is measured between 0.15 and 0.30mm from the terminal tip. 4. coplanarity applies to the exposed pad as well as the terminals. a seating plane d e 0.10 c a3 a a1 2x 2x 0.10 c udfn6, 1.8x2, 0.4p case 517cs issue o dim a min max millimeters 0.45 0.55 a1 0.00 0.05 a3 0.125 ref b 0.15 0.25 d d2 e e2 e l pin one reference 0.05 c 0.05 c note 4 e1/2 d2 e2 4 6 1 l 5 1.80 bsc 0.35 0.55 2.00 bsc 0.74 0.94 0.40 bsc 0.20 0.40 bottom view mounting footprint* recommended dimensions: millimeters *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. 2x l1 detail a l alternate constructions l ?? ?? l1 --- 0.15 side view top view b 6x c e1 0.80 bsc e2 0.95 bsc 2x a 0.07 c note 3 e2 b b 4 6 6x 1 5 0.05 c supplemental 0.10 c 0.10 c e1 6x e e/2 bottom view 6x 0.48 0.95 0.40 pitch 6x 0.25 0.40 pitch 0.55 2x 2.20 2x 0.94 package outline on semiconductor and are trademarks of semiconductor components industries, llc dba on semiconductor or its subsidiaries i n the united states and/or other countries. on semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property . a listing of on semiconductor?s product/patent coverage may be accessed at www.onsemi.com/site/pdf/patent?marking.pdf . on semiconductor reserves the right to make changes without further notice to any products herein. on semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does o n semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. buyer is responsible for its products and applications using on semiconductor products, including compliance with all laws, reg ulations and safety requirements or standards, regardless of any support or applications information provided by on semiconductor. ?typical? parameters which may be provided in on semiconductor data sheets and/or specifications can and do vary in dif ferent applications and actual performance may vary over time. all operating parameters, including ?typic als? must be validated for each customer application by customer?s technical experts. on semiconductor does not convey any license under its patent rights nor the right s of others. on semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any fda class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. should buyer purchase or use on semicondu ctor products for any such unintended or unauthorized application, buyer shall indemnify and hold on semiconductor and its officers, employees, subsidiaries, affiliates, and distrib utors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that on semiconductor was negligent regarding the design or manufacture of the part. on semiconductor is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. p ublication ordering information n. american technical support : 800?282?9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81?3?5817?1050 NSPM5131/d literature fulfillment : literature distribution center for on semiconductor 19521 e. 32nd pkwy, aurora, colorado 80011 usa phone : 303?675?2175 or 800?344?3860 toll free usa/canada fax : 303?675?2176 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your loc al sales representative ?
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